Okwu mmalite nke usoro egweri azụ wafer

Wafers ndị megoro nhazi n'ihu ma gafere ule wafer ga-amalite nhazi azụ azụ na azụ azụ.Ngwunye azụ bụ usoro nke na-eme ka azụ nke wafer ahụ dị ntakịrị, nzube ya abụghị nanị iji belata ọkpụkpụ nke wafer, kamakwa iji jikọta usoro n'ihu na azụ iji dozie nsogbu dị n'etiti usoro abụọ ahụ.Ka chip nke semiconductor dị gịrịgịrị, ka enwere ike ikpokọta ọtụtụ ibe na ntinye aka na-adị elu.Otú ọ dị, ka njikọ ahụ dị elu, na-ebelata arụmọrụ nke ngwaahịa ahụ.Ya mere, enwere esemokwu n'etiti ntinye na imeziwanye arụmọrụ ngwaahịa.Ya mere, usoro egweri nke na-ekpebi ọkpụrụkpụ wafer bụ otu n'ime igodo iji belata ọnụ ahịa nke ibe semiconductor na ikpebi ogo ngwaahịa.

1. Ebumnuche nke azụ azụ

Na usoro nke ịme semiconductors site na wafers, ọdịdị nke wafers na-agbanwe mgbe niile.Nke mbụ, na usoro nrụpụta wafer, Edge na elu nke wafer na-egbuke egbuke, usoro nke na-emekarị n'akụkụ abụọ nke wafer.Mgbe njedebe nke usoro njedebe n'ihu, ị nwere ike ịmalite usoro ịkụ azụ azụ nke na-eme ka azụ azụ nke wafer ahụ, nke nwere ike wepụ mmetọ kemịkalụ n'ime usoro njedebe ma belata ọkpụkpụ nke mgbawa, nke dị mma nke ọma. maka mmepụta nke obere ibe edokọbara na kaadị IC ma ọ bụ ngwaọrụ mkpanaka.Tụkwasị na nke a, usoro a nwere uru nke ibelata nguzogide, ibelata oriri ike, ịba ụba okpomọkụ na ikpo ọkụ ngwa ngwa na azụ nke wafer.Ma n'otu oge ahụ, n'ihi na wafer ahụ dị gịrịgịrị, ọ dị mfe ịgbaji ma ọ bụ mebie ya site na ndị agha mpụga, na-eme ka usoro nhazi ahụ sie ike karị.

2. Azụ egweri (Back-egweri) usoro zuru ezu

Enwere ike kewaa azụ azụ n'ime usoro atọ ndị a: nke mbụ, tapawa lamination teepu nchebe na wafer;Nke abụọ, gwerie azụ nke wafer;Nke atọ, tupu ikewapụ mgbawa na Wafer, a ga-etinye wafer ahụ n'elu Wafer Mounting nke na-echebe teepu ahụ.The wafer patch usoro bụ nkwadebe ogbo maka ikewa ndịmgbawa(ịcha mgbawa) ya mere enwere ike itinye ya na usoro ịkpụ.N'ime afọ ndị na-adịbeghị anya, ka ibe na-adịwanye njọ, usoro usoro ahụ nwekwara ike gbanwee, usoro usoro ahụ aghọwokwa nke ọma.

3. Usoro Lamination teepu maka nchebe wafer

Nzọụkwụ mbụ na-egweri azụ bụ mkpuchi.Nke a bụ usoro mkpuchi nke na-arapara teepu n'ihu wafer.Mgbe ị na-egweri na azụ, ogige silicon ga-agbasa gburugburu, na wafer ahụ nwekwara ike ịgbawa ma ọ bụ na-agbawa n'ihi ike ndị dị n'èzí n'oge usoro a, na nnukwu ebe wafer ahụ, na-enwekwu ike ime ihe a.Ya mere, tupu egweri azụ, a na-ejikọta ihe nkiri na-acha anụnụ anụnụ Ultra Violet (UV) iji chebe wafer.

Mgbe ị na-etinye ihe nkiri ahụ, ka ọ ghara ime ka oghere ma ọ bụ ikuku ikuku dị n'etiti wafer na teepu, ọ dị mkpa ịbawanye ike nrapado.Otú ọ dị, mgbe ị na-egweri na azụ, teepu dị na wafer kwesịrị ka ọkụ ultraviolet na-egbuke egbuke iji belata ike nrapado.Mgbe nkesachara, ihe fọdụrụ na teepu agaghị adị n'elu wafer.Mgbe ụfọdụ, usoro a ga-eji adhesion na-adịghị ike na-adịkarị mfe iji afụ na-abụghị ultraviolet ibelata ọgwụgwọ akpụkpọ ahụ, ọ bụ ezie na ọtụtụ adịghị ike, ma ọnụ ala.Na mgbakwunye, a na-ejikwa ihe nkiri Bump, nke toro okpukpu abụọ dị ka mkpuchi mbelata UV, ma na-atụ anya na a ga-eji ya na-abawanye ugboro n'ọdịnihu.

4. The wafer ọkpụrụkpụ bụ inversely hà na mgbawa ngwugwu

A na-ebelata oke wafer mgbe egweri azụ azụ site na 800-700 µm ruo 80-70 µm.Wafers gbadara ruo otu ụzọ n'ụzọ iri nwere ike ikpokọta ọkwa anọ ruo isii.N'oge na-adịbeghị anya, enwere ike ịbelata wafers ruo ihe dị ka milimita 20 site na usoro nchicha abụọ, si otú a na-atụba ha na 16 ruo 32 layers, usoro semiconductor multi-layer nke a maara dị ka ngwugwu multi-chip (MCP).N'okwu a, n'agbanyeghị na-eji otutu n'ígwé, ngụkọta elu nke okokụre ngwugwu agaghị gafere a ụfọdụ ọkpụrụkpụ, nke mere thinner egweri wafers mgbe niile na-achụso.The thinner na wafer, na-enwekwu ntụpọ, na ihe siri ike na-esote usoro bụ.Ya mere, teknụzụ dị elu dị mkpa iji meziwanye nsogbu a.

5. Mgbanwe nke usoro ịkụ azụ azụ

Site n'ịbelata wafer dị ka mkpa dị ka o kwere mee iji merie adịghị ike nke usoro nhazi, teknụzụ ịkụ azụ azụ na-aga n'ihu na-etolite.Maka wafer a na-ahụkarị nke nwere ọkpụrụkpụ nke 50 ma ọ bụ karịa, egweri azụ azụ na-agụnye usoro atọ: Mgwe nri siri ike na nke ọma na-egweri, ebe a na-egbutu wafer ma na-egbuke egbuke mgbe oge abụọ gachara.N'oge a, dị ka Chemical Mechanical Polishing (CMP), Slurry na Deionized Water na-etinyekarị n'etiti pad polishing na wafer.Ọrụ a na-egbuke egbuke nwere ike ibelata esemokwu dị n'etiti wafer na pad na-egbuke egbuke, ma mee ka elu ahụ na-egbuke egbuke.Mgbe wafer na-arị elu, enwere ike iji Super Fine Grinding, mana ka wafer na-esiwanye ike, ka a na-achọkwu polishing.

Ọ bụrụ na wafer na-adịwanye njọ, ọ na-enwekarị ntụpọ mpụga n'oge usoro ịkpụ.Ya mere, ọ bụrụ na ọkpụrụkpụ nke wafer bụ 50 µm ma ọ bụ obere, usoro usoro nwere ike ịgbanwe.N'oge a, a na-eji usoro DBG (Dicing Before Grinding), ya bụ, a na-egbutu wafer na ọkara tupu egweri mbụ.A na-ekewapụ mgbawa ahụ n'enweghị nsogbu na wafer n'usoro nke Dicing, egweri na slicing.Tụkwasị na nke ahụ, e nwere ụzọ ndị pụrụ iche egweri nke na-eji efere iko siri ike na-egbochi wafer na-agbaji.

Site na mmụba na-arịwanye elu maka ntinye aka na miniaturization nke ngwa eletriki, nkà na ụzụ na-egweri azụ kwesịrị ọ bụghị nanị imeri njedebe ya, kamakwa ịnọgide na-etolite.N'otu oge ahụ, ọ bụghị naanị na ọ dị mkpa iji dozie nsogbu ntụpọ nke wafer, kamakwa ịkwadebe maka nsogbu ọhụrụ nwere ike ibilite na usoro n'ọdịnihu.Iji dozie nsogbu ndị a, ọ nwere ike ịdị mkpaịgbanweeusoro usoro, ma ọ bụ ewebata teknụzụ etching kemịkalụ etinyere nasemiconductorusoro n'ihu, ma mepụta usoro nhazi ọhụrụ n'ụzọ zuru ezu.Iji dozie ntụpọ dị n'ime nke wafers buru ibu, a na-enyocha ụzọ dị iche iche egweri.Tụkwasị na nke ahụ, a na-eme nyocha maka otu esi eji akwa silicon slag emepụtara ma egweri wafers.

Oge nzipu: Jul-14-2023